On August 10, 2023, the 2023 Wide Bandgap Semiconductor Advanced Technology Innovation and Application Development Summit Forum, sponsored by Zhongguancun Tianhe Wide Bandgap Semiconductor Technology Innovation Alliance and co-organized by China Machine Tool Industry Association Superhard Materials Branch and other units, was held in Beijing. Nearly 200 companies participated in the meeting. The Department of Raw Materials Industry of the Ministry of Industry and Information Technology attended and delivered a speech.

Academician Zou Guangtian of Jilin University introduced the latest research results of ultra-wide bandgap semiconductor materials represented by diamond. More than 30 experts, scholars and entrepreneurs made keynote reports on the preparation and application of wide bandgap and ultra-wide bandgap semiconductor materials, introduced the latest achievements in industry development, predicted the development trend of the industry, and proposed to promote the healthy and sustainable development of the industry suggestion. At the same time, more than 40 companies displayed their latest products on the spot, and diamond, silicon carbide and other related material companies participated in the exhibition.

The purpose of the conference is to adhere to the combination of "demand traction" and "material first", and strive to create an upstream and downstream innovation exchange platform for wide bandgap semiconductor materials and devices, and promote the high-quality development of wide bandgap semiconductor industry.

Zhecheng County Jinxin Abrasives Co., Ltd., as an enterprise that has been deeply involved in the diamond powder industry for decades, was invited to participate in this event. During the meeting, communicate and communicate with the participating experts, guests and professional audiences. Academician Zou Guangtian visited our company's booth in his busy schedule and had in-depth exchanges with the company's general manager Li Peng and technical service personnel.